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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z045-1FFG900CES

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XC7Z045-1FFG900CES

Manufacturer:
Xilinx
Package/Case:
900-BBGA, FCBGA
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7Z045-1FFG900CES
Product Categories:
Embedded - System On Chip (SoC)
Description:
Zynq-7000 SoC Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 350K Logic Cells 256KB 900-FCBGA
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XC7Z045-1FFG900CES Overview

Xilinx AMD XC7Z045-1FFG900CES is an embedded IC in the field-programmable gate array category categorized under the Zynq-7000 SoC series. This system on a chip has a 900-BBGA, FCBGA package issued to it by the maker. This XC7Z045-1FFG900CES's implementation of 256KB RAM guarantees consumers' effective performance. This SoC design uses an MCU and FPGA combination for its internal architecture. Zynq-7000 series system on chips with included SoCs. XC7Z045-1FFG900CES is advised to run this SoC meaning between 0°C and 85°C TJ on average. This SoC security also incorporates 350K Logic Cells and a Kintex-7 FPGA contained in a cutting-edge tray packaging. This SoC component contains 130 I/Os. For system on chips with comparable specifications and functions, look up XC7Z045. At 667MHz, wireless SoCs are active. There are a number of features to this SoC meaning which are based on the core architecture of ARM.

 

XC7Z045-1FFG900CES Features

  • Instruction and data caches with a 4-way set in Level 1 that are 32 KB in size and independent of each CPU

  • 8-way set-associative Level 2 cache with 512 KB (shared by the CPUs)

  • Support for byte parity

  • 256 KB on-chip RAM (OCM) with on-chip boot ROM

  • Support for byte parity

  • 8-bit SRAM data bus that supports up to 64 MB

  • Support for parallel NOR flash

  • Support for ONFI1.0 NAND memory (1-bit ECC)

  • SPIs can be one bit, two bits, four bits (quad-SPI), or two quad-SPIs (8 bits). NOR serial flash

 

XC7Z045-1FFG900CES Applications

  • Automotive driver assistance

  • Driver information

  • Infotainment

  • Broadcast camera

  • Medical diagnostics and imaging

  • ADAS

  • Medical Endoscope

  • Small Cell Baseband

  • Professional Cameras


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z045-1FFG900CES Specifications

SpecificationValue
CategoryEmbedded System On Chip (SoC)
MfrAMD
SeriesZynq-7000 SoC
PackageTray
Product StatusObsolete
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)
Number of I/O130
Base Product NumberXC7Z045


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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