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XC7Z045-1FFG900CES

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XC7Z045-1FFG900CES

Manufacturer:
Xilinx
Package/Case:
900-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z045-1FFG900CES
Product Categories:
Embedded - System On Chip (SoC)
Description:
Zynq-7000 SoC Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 350K Logic Cells 256KB 900-FCBGA
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XC7Z045-1FFG900CES Overview

Xilinx AMD XC7Z045-1FFG900CES is an embedded IC in the field-programmable gate array category categorized under the Zynq-7000 SoC series. This system on a chip has a 900-BBGA, FCBGA package issued to it by the maker. This XC7Z045-1FFG900CES's implementation of 256KB RAM guarantees consumers' effective performance. This SoC design uses an MCU and FPGA combination for its internal architecture. Zynq-7000 series system on chips with included SoCs. XC7Z045-1FFG900CES is advised to run this SoC meaning between 0°C and 85°C TJ on average. This SoC security also incorporates 350K Logic Cells and a Kintex-7 FPGA contained in a cutting-edge tray packaging. This SoC component contains 130 I/Os. For system on chips with comparable specifications and functions, look up XC7Z045. At 667MHz, wireless SoCs are active. There are a number of features to this SoC meaning which are based on the core architecture of ARM.

 

XC7Z045-1FFG900CES Features

  • Instruction and data caches with a 4-way set in Level 1 that are 32 KB in size and independent of each CPU

  • 8-way set-associative Level 2 cache with 512 KB (shared by the CPUs)

  • Support for byte parity

  • 256 KB on-chip RAM (OCM) with on-chip boot ROM

  • Support for byte parity

  • 8-bit SRAM data bus that supports up to 64 MB

  • Support for parallel NOR flash

  • Support for ONFI1.0 NAND memory (1-bit ECC)

  • SPIs can be one bit, two bits, four bits (quad-SPI), or two quad-SPIs (8 bits). NOR serial flash

 

XC7Z045-1FFG900CES Applications

  • Automotive driver assistance

  • Driver information

  • Infotainment

  • Broadcast camera

  • Medical diagnostics and imaging

  • ADAS

  • Medical Endoscope

  • Small Cell Baseband

  • Professional Cameras


XC7Z045-1FFG900CES Specifications

SpecificationValue
CategoryEmbedded System On Chip (SoC)
MfrAMD
SeriesZynq-7000 SoC
PackageTray
Product StatusObsolete
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)
Number of I/O130
Base Product NumberXC7Z045


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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