On this XC7Z045-2FF900I, there is Dual ARM Cortex-A9 MPCore with CoreSight core processor. The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications. XC7Z045-2FF900I is equipped with 256KB RAM and guarantees reliable performance to the user. The SoC design uses MCU, FPGA architecture for its internal architecture. Zynq-7000 is the series in which this system on chip SoC falls under. Typical operating temperatures for this XC7Z045-2FF900I meaning should be -40°C~100°C TJ. There is one thing to note about this SoC security: it combines Kintex-7 FPGA, 350K Logic Cells. Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance. This SoC part contains a total of 130 I/Os in total. There are 900 terminations in total and that really benefits system on a chip.Moreover, this SoC processor also includes GPIO WITH FOUR 32-BIT BANKS as its additional features. It is important to note that this SoC follows a frequency of 800MHz.
USB 2.0 compliant device IP core
Supports on-the-go, high-speed, full-speed, and low-speed modes
Intel EHCI compliant USB host
8-bit ULPI external PHY interface
Two full CAN 2.0B compliant CAN bus interfaces
CAN 2.0-A and CAN 2.0-B and ISO 118981-1 standard compliant
External PHY interface
Automotive driver assistance, driver information, and infotainment
Broadcast camera
Industrial motor control, industrial networking, and machine vision
IP and Smart camera
LTE radio and baseband
Medical diagnostics and imaging
Multifunction printers
Video and night vision equipment
Specification | Value |
Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Mfr | AMD |
Series | Zynq®-7000 |
Package | Tray |
Product Status | Active |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31x31) |
Number of I/O | 130 |
Base Product Number | XC7Z045 |
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