A System On Chip (SOC) IC series made by Xilinx Inc. is the XC7Z045-2FFG676E. It has a tray package and is part of the Zynq-7000 series. An integrated circuit called the XC7Z045-2FFG676E is made for usage in various electronic parts. It is a product of moderate popularity with a constrained supply and demand situation. This product's production lead time is predicted to be 51 weeks. The REACH status has no effect on the XC7Z045-2FFG676E. This product's HTSUS code is 8542.39.0001.
Custom software and logic can be implemented in the PL and PS using the Zynq-7000 architecture. XC7Z045-2FFG676E enables the execution of distinctive and differentiating system functions. Due to their constrained I/O bandwidth, latency, and power budgets, two-chip systems (such as an ASSP with an FPGA) cannot achieve the performance levels possible with the PS and PL integrated together. For the Zynq-7000 family, Xilinx provides a wide range of soft IP. The PS and PL peripherals have standalone and Linux device drivers available. For software, hardware, and systems engineers, the Vivado® Design Suite development environment facilitates a quick product development process.
Two SD/SDIO 2.0/MMC3.31 compliant controllers
Two full-duplex SPI ports with three peripheral chip selects
Two high-speed UARTs (up to 1 Mb/s)
Two master and slave I2C interfaces
GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic
Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments
Automotive driver assistance, driver information, and infotainment
Broadcast camera
Industrial motor control, industrial networking, and machine vision
IP and Smart camera
LTE radio and baseband
Medical diagnostics and imaging
Multifunction printers
Video and night vision equipment
Specification | Value |
Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Mfr | AMD |
Series | Zynq®-7000 |
Package | Tray |
Product Status | Active |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
Operating Temperature | 0°C ~ 100°C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) |
Number of I/O | 130 |
Base Product Number | XC7Z045 |
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