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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z045-2FFG676E

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XC7Z045-2FFG676E

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7Z045-2FFG676E
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 350K Logic Cells 256KB 676-FCBGA
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XC7Z045-2FFG676E Overview

A System On Chip (SOC) IC series made by Xilinx Inc. is the XC7Z045-2FFG676E. It has a tray package and is part of the Zynq-7000 series. An integrated circuit called the XC7Z045-2FFG676E is made for usage in various electronic parts. It is a product of moderate popularity with a constrained supply and demand situation. This product's production lead time is predicted to be 51 weeks. The REACH status has no effect on the XC7Z045-2FFG676E. This product's HTSUS code is 8542.39.0001.

Custom software and logic can be implemented in the PL and PS using the Zynq-7000 architecture. XC7Z045-2FFG676E enables the execution of distinctive and differentiating system functions. Due to their constrained I/O bandwidth, latency, and power budgets, two-chip systems (such as an ASSP with an FPGA) cannot achieve the performance levels possible with the PS and PL integrated together. For the Zynq-7000 family, Xilinx provides a wide range of soft IP. The PS and PL peripherals have standalone and Linux device drivers available. For software, hardware, and systems engineers, the Vivado® Design Suite development environment facilitates a quick product development process.

 

XC7Z045-2FFG676E Features

  • Two SD/SDIO 2.0/MMC3.31 compliant controllers

  • Two full-duplex SPI ports with three peripheral chip selects

  • Two high-speed UARTs (up to 1 Mb/s)

  • Two master and slave I2C interfaces

  • GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

  • Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

 

XC7Z045-2FFG676E Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z045-2FFG676E Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z045


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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