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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z045-2FFG676I

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XC7Z045-2FFG676I

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z045-2FFG676I
Product Categories:
System On Chip (SoC)
Description:
Zynq-7000 SoC Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip 256KB 350K Logic Cells 676-FCBGA
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XC7Z045-2FFG676I Overview

Zynq-7000 FPGA with 350K logic cells and a dual ARM Cortex-A9 MPCore with CoreSight is the Xilinx Inc. XC7Z045-2FFG676I. The gadget is placed on a 676-BBGA package and features 130 I/Os. It has a working speed of 800MHz and a temperature range of -40°C to 100°C. A number of communication options are available for the device, including CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The component, which is frequently used in many different electronic applications, is intended for use in integrated circuits (ICs). It is produced internationally and has an ECCN of EAR99.

The XC7Z045-2FFG676I is built on a foundation of the Xilinx SoC architecture. These products combine a feature-rich dual-core or single-core ARM® CortexTM-A9 processor system (PS) with a 28 nm Xilinx programmable logic (PL) chip. The PS's brains are made up of ARM Cortex-A9 CPUs, which also contain on-chip memory, external memory interfaces, and a variety of peripheral connectivity interfaces.

 

XC7Z045-2FFG676I Features

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

  • Static memory interfaces

  • 8-bit SRAM data bus with up to 64 MB support

  • Parallel NOR flash support

  • ONFI1.0 NAND flash support (1-bit ECC)

  • 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash

 

XC7Z045-2FFG676I Applications

  • ADAS

  • Medical Endoscope

  • Small Cell Baseband

  • Professional Cameras

  • Machine Vision

  • Carrier Ethernet Backhaul

  • Multi-function Printers

  • Multi-Axis Motor Control


XC7Z045-2FFG676I Specifications

SpecificationValue
TypeDescription
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z045


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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