This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.
Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z045-3FFG676E

Images are for reference only.

XC7Z045-3FFG676E

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7Z045-3FFG676E
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 350K Logic Cells 256KB 676-FCBGA
Need this part? Submit an inquiry and our sourcing team will check current availability, source, date code, packaging and lead time.
quantity
email
contact
company
Telephone
country
content

XC7Z045-3FFG676E Overview

In this XC7Z045-3FFG676E, there are two ARM Cortex-A9 MPCore processors with CoreSight cores. The manufacturer has put this system on a chip as 676-BBGA, FCBGA. Users are given a SoC chip with 256KB RAM so they may experience dependable performance. For its internal architecture, the SoC design uses MCU and FPGA architecture. The system on a chip is a member of the Zynq-7000 family. The typical working temperature for this XC7Z045-3FFG676E should be between 0°C and 100°C TJ. XC7Z045-3FFG676E is significant to remember that this SoC security integrates 350K Logic Cells with a Kintex-7 FPGA. This system-on-chip is housed in the cutting-edge Tray packaging. This SoC portion has 130 I/Os in total.It is advised to use a power supply with a 1V rating.

Above 1.05V, the SoCs wireless have no safe voltage. The total number of terminations needed to support a system-on-a-chip is 676. You will receive a system on chip with the same features and functions as XC7Z045. The wireless SoC functions at 1GHz.The SoC, which is highly performant, is built on the ARM core architecture.

 

XC7Z045-3FFG676E Features

  • Two 10/100/1000 tri-speed Ethernet MAC peripherals with

  • IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support

  • Scatter-gather DMA capability

  • Recognition of 1588 rev. 2 PTP frames

  • GMII, RGMII, and SGMII interfaces

  • Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

  • USB 2.0 compliant device IP core

  • Supports on-the-go, high-speed, full-speed, and low-speed modes

  • Intel EHCI compliant USB host

  • 8-bit ULPI external PHY interface

 

XC7Z045-3FFG676E Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z045-3FFG676E Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1GHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z045


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

ASSOCIATED PRODUCTS

  • XC7Z007S-2CLG225E

    XC7Z007S-2CLG225E

    Buy XC7Z007S-2CLG225E Xilinx, Inc, Get familiar with the XC7Z007S-2CLG225E Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG400I

    XC7Z007S-1CLG400I

    Buy XC7Z007S-1CLG400I Xilinx, Inc, Get familiar with the XC7Z007S-1CLG400I Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG400C

    XC7Z007S-1CLG400C

    Buy XC7Z007S-1CLG400C Xilinx, Inc, Get familiar with the XC7Z007S-1CLG400C Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG225I

    XC7Z007S-1CLG225I

    Buy XC7Z007S-1CLG225I Xilinx, Inc, Get familiar with the XC7Z007S-1CLG225I Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG225C

    XC7Z007S-1CLG225C

    Buy XC7Z007S-1CLG225C Xilinx, Inc, Get familiar with the XC7Z007S-1CLG225C Zynq-7000 SoC at VEKEMO F...