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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z045-3FFG676E

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XC7Z045-3FFG676E

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z045-3FFG676E
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 350K Logic Cells 256KB 676-FCBGA
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XC7Z045-3FFG676E Overview

In this XC7Z045-3FFG676E, there are two ARM Cortex-A9 MPCore processors with CoreSight cores. The manufacturer has put this system on a chip as 676-BBGA, FCBGA. Users are given a SoC chip with 256KB RAM so they may experience dependable performance. For its internal architecture, the SoC design uses MCU and FPGA architecture. The system on a chip is a member of the Zynq-7000 family. The typical working temperature for this XC7Z045-3FFG676E should be between 0°C and 100°C TJ. XC7Z045-3FFG676E is significant to remember that this SoC security integrates 350K Logic Cells with a Kintex-7 FPGA. This system-on-chip is housed in the cutting-edge Tray packaging. This SoC portion has 130 I/Os in total.It is advised to use a power supply with a 1V rating.

Above 1.05V, the SoCs wireless have no safe voltage. The total number of terminations needed to support a system-on-a-chip is 676. You will receive a system on chip with the same features and functions as XC7Z045. The wireless SoC functions at 1GHz.The SoC, which is highly performant, is built on the ARM core architecture.

 

XC7Z045-3FFG676E Features

  • Two 10/100/1000 tri-speed Ethernet MAC peripherals with

  • IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support

  • Scatter-gather DMA capability

  • Recognition of 1588 rev. 2 PTP frames

  • GMII, RGMII, and SGMII interfaces

  • Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

  • USB 2.0 compliant device IP core

  • Supports on-the-go, high-speed, full-speed, and low-speed modes

  • Intel EHCI compliant USB host

  • 8-bit ULPI external PHY interface

 

XC7Z045-3FFG676E Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z045-3FFG676E Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1GHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z045


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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