XC7Z045-3FFV676E

XC7Z045-3FFV676E Overview

This XC7Z045-3FFV676E is constructed using the Dual ARM Cortex A9 MPCore with CoreSight as its core processor(s). The manufacturer claims that the packaging for this system on a chip is 676-BBGA, FCBGA. Users are given a SoC chip with 256KB RAM so they may experience dependable performance. The internal architecture of this XC7Z045-3FFV676E design is straightforward thanks to the MCU, FPGA method. This system on chip SoC is a part of the Zynq 7000 series. XC7Z045-3FFV676E is advised that this SoC be operated on average between 0°C and 100°C TJ. One thing about this SoC security is that it includes 350K Logic Cells and a Kintex 7 FPGA. This SoC system on a chip is housed in a cutting-edge Bulk packaging. There are 130 I/Os in total in this SoC portion.

XC7Z045-3FFV676E Features

• Multiprotocol dynamic memory controller

• 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

• ECC support in 16-bit mode

• 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

• Static memory interfaces

• 8-bit SRAM data bus with up to 64 MB support

• Parallel NOR flash support

• ONFI1.0 NAND flash support (1-bit ECC)

• 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash

XC7Z045-3FFV676E Applications

• Automotive driver assistance, driver information, and infotainment

• Broadcast camera

• Industrial motor control, industrial networking, and machine vision

• IP and Smart camera

• LTE radio and baseband

• Medical diagnostics and imaging

• Multifunction printers

• Video and night vision equipment

XC7Z045-3FFV676E Specifications