There are two ARM Cortex A9 MPCore processors with CoreSight on this XC7Z100-1FF900I.The manufacturer has given this system on a chip the package number 900-BBGA, FCBGA. This XC7Z100-1FF900I offers dependable operation thanks to its 256KB RAM implementation. This SoC design uses MCU and FPGA technology internally. This system on chip SoC is a part of the Zynq 7000 series. This XC7Z100-1FF900I is anticipated to function typically between -40°C and 100°C TJ. The Kintex 7 FPGA and 444K Logic Cells together make up an important aspect of this SoC's security. There are 130 I/Os in this SoC portion altogether. The wireless SoC operates at a frequency of 667MHz during operation. The main architecture of the SoC is based on ARM. The SoC computing will start only if -40°C is set.This SoC system on chip operates at a maximum design temperature of 100°C.
USB 2.0 compliant device IP core
Supports on-the-go, high-speed, full-speed, and low-speed modes
Intel EHCI compliant USB host
8-bit ULPI external PHY interface
Multiprotocol dynamic memory controller
16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories
ECC support in 16-bit mode
1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories
Wireless Communications: Support for multiple spectral bands and smart antennas
Wired Communications: Multiple wired communications standards and context-aware network services
Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics
Smarter Vision: Evolving video-processing algorithms, object detection, and analytics
Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety
ADAS
Medical Endoscope
Small Cell Baseband
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| Specification | Value |
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Mfr | AMD |
| Series | Zynq®-7000 |
| Package | Tray |
| Product Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Number of I/O | 130 |
| Base Product Number | XC7Z100 |
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