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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z100-1FF900I

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XC7Z100-1FF900I

Manufacturer:
Xilinx
Package/Case:
900-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z100-1FF900I
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 444K Logic Cells 256KB 900-FCBGA
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XC7Z100-1FF900I Overview

There are two ARM Cortex A9 MPCore processors with CoreSight on this XC7Z100-1FF900I.The manufacturer has given this system on a chip the package number 900-BBGA, FCBGA. This XC7Z100-1FF900I offers dependable operation thanks to its 256KB RAM implementation. This SoC design uses MCU and FPGA technology internally. This system on chip SoC is a part of the Zynq 7000 series. This XC7Z100-1FF900I is anticipated to function typically between -40°C and 100°C TJ. The Kintex 7 FPGA and 444K Logic Cells together make up an important aspect of this SoC's security. There are 130 I/Os in this SoC portion altogether. The wireless SoC operates at a frequency of 667MHz during operation. The main architecture of the SoC is based on ARM. The SoC computing will start only if -40°C is set.This SoC system on chip operates at a maximum design temperature of 100°C.

 

XC7Z100-1FF900I Features

  • USB 2.0 compliant device IP core

  • Supports on-the-go, high-speed, full-speed, and low-speed modes

  • Intel EHCI compliant USB host

  • 8-bit ULPI external PHY interface

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

 

XC7Z100-1FF900I Applications

  • Wireless Communications: Support for multiple spectral bands and smart antennas

  • Wired Communications: Multiple wired communications standards and context-aware network services

  • Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics

  • Smarter Vision: Evolving video-processing algorithms, object detection, and analytics

  • Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety

  • ADAS

  • Medical Endoscope

  • Small Cell Baseband


XC7Z100-1FF900I Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)
Number of I/O130
Base Product NumberXC7Z100


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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