A highly flexible and adaptable system that can be customized to meet particular application requirements is made possible by the integration. Wide-ranging features and functionalities are available with the XC7Z100-2FFG900I, including high-speed connectivity choices like Gigabit Ethernet, USB 2.0, and PCIe. The device also supports a wide range of peripherals like SPI, I2C, and UART, as well as a number of memory interfaces like DDR3 and LPDDR2. Users have the option to implement unique logic functions and use hardware acceleration to speed up processing tasks thanks to the FPGA fabric. The XC7Z100-2FFG900I is a great option for applications that require high-performance computing and real-time processing capabilities due to its combination of processing power and programmable logic. This device is well suited for use in a variety of applications, including industrial automation, aerospace and defense, medical imaging, and more, thanks to its cutting-edge features and adaptable architecture.
Jazelle® RCT execution Environment Architecture
NEON™ media-processing engine
Single and double precision Vector Floating Point Unit (VFPU)
CoreSight™ and Proggram Trace Macrocell (PTM)
2.5 DMIPS/MHz per CPU
CPU frequency: Up to 1 GHz
Coherent multiprocessor support
ARMv7-A architecture
The 900-BBGA or FCBGA format packaging is a reliable and efficient way to house the electronic component. With a temperature range for operation of -40 to 100 degrees Celsius (TJ), this device can withstand harsh environments. The supplier's device package, 900-FCBGA, measures 31x31 and offers ample space for the component's features. Running at an impressive speed of 800 MHz, this device is capable of handling complex tasks with ease. The embedded 1956 kbits of block RAM provide additional memory capacity for data storage and retrieval. The DMA peripheral is sized at 256 KB, making it ideal for high-speed data transfer operations. The architecture of this device consists of both MCU and FPGA components, allowing for flexibility in design and implementation. Overall, the combination of these features makes this electronic component a powerful tool for a variety of applications.
Artificial Intelligence
5G Technology
Cloud computing
Consumer electronics
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Specification | Value |
---|---|
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31x31) |
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