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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z100-2FFG900I

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XC7Z100-2FFG900I

Manufacturer:
Xilinx
Package/Case:
FCBGA-900
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
Product Categories:
Microprocessors
Description:
FPGA Kintex-7 Family IC 444000 Cells 28nm Technology Automotive 900-Pin FCBGA
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XC7Z100-2FFG900I Overview

A highly flexible and adaptable system that can be customized to meet particular application requirements is made possible by the integration. Wide-ranging features and functionalities are available with the XC7Z100-2FFG900I, including high-speed connectivity choices like Gigabit Ethernet, USB 2.0, and PCIe. The device also supports a wide range of peripherals like SPI, I2C, and UART, as well as a number of memory interfaces like DDR3 and LPDDR2. Users have the option to implement unique logic functions and use hardware acceleration to speed up processing tasks thanks to the FPGA fabric. The XC7Z100-2FFG900I is a great option for applications that require high-performance computing and real-time processing capabilities due to its combination of processing power and programmable logic. This device is well suited for use in a variety of applications, including industrial automation, aerospace and defense, medical imaging, and more, thanks to its cutting-edge features and adaptable architecture.

 

XC7Z100-2FFG900I Features

  • Jazelle® RCT execution Environment Architecture

  • NEON™ media-processing engine

  • Single and double precision Vector Floating Point Unit (VFPU)

  • CoreSight™ and Proggram Trace Macrocell (PTM)

  • 2.5 DMIPS/MHz per CPU

  • CPU frequency: Up to 1 GHz

  • Coherent multiprocessor support

  • ARMv7-A architecture

 The 900-BBGA or FCBGA format packaging is a reliable and efficient way to house the electronic component. With a temperature range for operation of -40 to 100 degrees Celsius (TJ), this device can withstand harsh environments. The supplier's device package, 900-FCBGA, measures 31x31 and offers ample space for the component's features. Running at an impressive speed of 800 MHz, this device is capable of handling complex tasks with ease. The embedded 1956 kbits of block RAM provide additional memory capacity for data storage and retrieval. The DMA peripheral is sized at 256 KB, making it ideal for high-speed data transfer operations. The architecture of this device consists of both MCU and FPGA components, allowing for flexibility in design and implementation. Overall, the combination of these features makes this electronic component a powerful tool for a variety of applications.       

XC7Z100-2FFG900I Applications

  • Artificial Intelligence

  • 5G Technology

  • Cloud computing

  • Consumer electronics

  • Wireless Technology

  • Industrial Control

  • Internet of Things

  • Medical Equipment


XC7Z100-2FFG900I Specifications

SpecificationValue
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Operating Temperature-40℃ ~ 100℃ (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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