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XC7Z100-L2FFG1156I

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XC7Z100-L2FFG1156I

Manufacturer:
Xilinx
Package/Case:
1156-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z100-L2FFG1156I
Product Categories:
Embedded - System On Chip (SoC)
Description:
Zynq®-7000 Kintex™-7 FPGA System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 444K Logic Cells 1156-FCBGA
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XC7Z100-L2FFG1156I Overview

AMD Xilinx produces the system on chip (SoC) known as the XC7Z100-L2FFG1156I. It has two 800MHz dual-core ARM Cortex-A9 MPCore processors with CoreSight. Along with DMA peripherals, the XC7Z100-L2FFG1156I supports CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG connections. It features a 444K logic cell KintexTM-7 FPGA, 130 I/Os, and 256 KB of RAM. This SoC has a package size of 1156-FCBGA (35x35) and can function between -40°C and 100°C. The XC7Z100-L2FFG1156I is REACH unaffected and has a fake threat of 65 in the open market.

Based on the Xilinx SoC architecture is the XC7Z100-L2FFG1156I. These products combine a feature-rich dual-core or single-core ARM Cortex-A9 processor system (PS) with a 28 nm Xilinx programmable logic (PL) chip into a single unit. The PS's brains are made up of ARM Cortex-A9 CPUs, which also contain on-chip memory, external memory interfaces, and a variety of peripheral connectivity interfaces. The XC7Z100-L2FFG1156I has speed grades of 3, 2, 2, -2LI, 1, and -1LQ, with 3 having the best performance.

 

XC7Z100-L2FFG1156I Features

  • Two SD/SDIO 2.0/MMC3.31 compliant controllers

  • Two full-duplex SPI ports with three peripheral chip selects

  • Two high-speed UARTs (up to 1 Mb/s)

  • Two master and slave I2C interfaces

  • GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

  • Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

 

XC7Z100-L2FFG1156I Applications

  • ADAS

  • Medical Endoscope

  • Small Cell Baseband

  • Professional Cameras

  • Machine Vision

  • Carrier Ethernet Backhaul

  • Multi-function Printers

  • Multi-Axis Motor Control


XC7Z100-L2FFG1156I Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1156-FCBGA (35x35)
Number of I/O130
Base Product NumberXC7Z100


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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