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Home > Product > Xilinx, Inc > Kintex UltraScale FPGA
XCKU035-3FBVA676E

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XCKU035-3FBVA676E

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
FPGA Kintex UltraScale Family 355474 Cells 20nm Technology 1V 676-Pin FCBGA
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XCKU035-3FBVA676E Overview

Using both monolithic and the most recent stacked silicon interface (SSI) technology, XCKU035-3FBVA676E is high-performance FPGA with a focus on price/performance. An ideal balance of capability and affordability is made possible by next-generation transceivers, high DSP and block RAM-to-logic ratios, and affordable packaging.

With the largest signal processing bandwidth in a mid-range device, next-generation transceivers, and affordable packaging, XCKU035-3FBVA676E offers the best price/performance/watt at 20nm for an ideal balance of capabilities and cost-effectiveness. XCKU035-3FBVA676E is perfect for DSP-intensive processing required in next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure, as well as packet processing in 100G networking and data center applications.

Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XCKU035-3FBVA676E Specifications

Specification Value
Number of LABs/CLBs 25391
Number of Logic Elements/Cells 444343
Total RAM Bits 19456000
Number of I/O 312
Voltage - Supply 0.970V ~ 1.030V
Mounting Type Surface Mount
Operating Temperature 0℃ ~ 100℃ (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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