The XCKU3P-3FFVD900E delivers the most cost-effective solution for high-end capabilities including transceiver and memory interface line rates, as well as 100G connectivity cores, in a FinFET node. In addition to being well suited for applications ranging from wireless MIMO technology to Nx100G networking and data centers, our newest mid-range family is also excellent for packet processing and DSP-intensive tasks.
Performance improvements and on-chip UltraRAM memory can lower BOM costs. the perfect balancing act between high-performance peripherals and economical system implementation. The multiple power options available in Kintex UltraScale+ FPGAs provide the ideal balance between the desired system performance and the smallest possible power envelope.
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 20340 |
| Number of Logic Elements/Cells | 355950 |
| Total RAM Bits | 31641600 |
| Number of I/O | 304 |
| Voltage - Supply | 0.873V ~ 0.927V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0℃ ~ 100℃ (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
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