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Home > Product > Xilinx, Inc > Virtex-E 1.8V FPGAs
XCV1600E-6BG560C

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XCV1600E-6BG560C

Manufacturer:
Xilinx
Package/Case:
BGA-560
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
Protection ESD
Description:
FPGA Virtex-E Family 419.904K Gates 34992 Cells 357MHz 0.18um Technology 1.8V 560-Pin Metal BGA
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XCV1600E-6BG560C Overview

High-performance, high-capacity programmable logic solutions are provided by the XCV1600E-6BG560C. By utilizing an aggressive 6-layer metal 0.18 m CMOS process and optimizing the new design for place-and-route efficiency, significant gains in silicon efficiency are achieved. These developments make mask-programmed gate arrays less powerful and more rigid than Virtex-E FPGAs.

The XCV1600E-6BG560C is an evolutionary step in programmable logic design, building on knowledge learned from Virtex FPGAs. This device provides a high-speed and high-capacity programmable logic solution that increases design flexibility while decreasing time-to-market by combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology.

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Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XCV1600E-6BG560C Specifications

Specification Value
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 404
Number of Gates 2188742
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0℃ ~ 85℃ (TJ)
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5x42.5)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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