High-performance, high-capacity programmable logic solutions are provided by XCV200-4FG256I. By utilizing an aggressive 5-layer-metal 0.22 m CMOS process and optimizing the new design for place-and-route efficiency, significant gains in silicon efficiency are achieved. These developments transform XCV200-4FG256I into potent and adaptable substitutes for mask-programmed gate array.
XCV200-4FG256I, which builds on knowledge garnered from earlier FPGA generations, offers a major advance in programmable logic architecture. This device provides a high-speed and high-capacity programmable logic solution that improves design freedom while decreasing time-to-market by combining a wide variety of programmable system features, a deep hierarchy of fast, flexible interconnect resources, and superior manufacturing technology. For more details on device architecture and timing requirements, consult the commercial data sheet for the Virtex 2.5V Field Programmable Gate Arrays.
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 1176 |
| Number of Logic Elements/Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 176 |
| Number of Gates | 236666 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
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