The best performance and integration capabilities on a 14nm/16nm FinFET node are offered by XCVU19P-2FSVA3824E. Third-generation 3D ICs from Xilinx employ stacked silicon interconnect (SSI) technology to overcome Moore's law's constraints and provide the highest signal processing and serial I/O bandwidth in order to meet the most stringent design requirements. Additionally, it offers clocking that is plentiful and flexible, registered inter-die routing connections that enable >600 MHz operation, and a virtually monolithic design experience.
The XCVU19P-2FSVA3824E is perfect for compute-intensive applications, such as 1+Tb/s networking, machine learning, and radar/early-warning systems, as they are the most powerful FPGA family in the market.
The XCVU19P-2FSVA3824E architecture's maximum transceiver bandwidth, DSP count, and on-chip and in-package memory capacities. Numerous power options offered by Virtex UltraScale+ FPGAs provide deliver the best compromise between the desired system performance and the smallest power envelope.
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