The XCZU3EG-1SFVC784I architecture serves as the foundation for the Zynq® UltraScale+TM MPSoC family. The Xilinx programmable logic (PL) UltraScale architecture and a feature-rich 64-bit quad-core or dual-core Arm® Cortex®-A53 and Arm Cortex-R5F based processing system (PS) are combined in a single product in this family of devices. On-chip memory, multiport external memory interfaces, and a wide range of peripheral connectivity ports are also included.
In the form of an optimal blend of heterogeneous processing engines housed in a subsequent-generation, high-performance, on-chip connection with suitable on-chip memory subsystems, the XCZU3EG-1SFVC784I offers unheard-of processing, I/O, and memory bandwidth. The XCZU3EG-1SFVC784I delivers the extensive performance and efficiency required to address next-generation smarter systems while maintaining backwards compatibility with the original Zynq-7000 All Programmable SoC family thanks to heterogeneous processing and programmable engines that are optimized for different application tasks. Additionally, the UltraScale MPSoC architecture includes various security levels, improved safety, and sophisticated power management, which are essential components of the next-generation smarter systems. The UltraScale MPSoC architecture's ASIC-class features are fully utilized by Xilinx's embedded UltraFastTM design approach, facilitating quick system development.
Engine NEON Advanced SIMD media processing
CoreSightTM, Embedded Trace Macrocell (ETM), Single/Double Precision Floating Point Unit (FPU), and Accelerator Coherency Port (ACP)
The ACE (AXI Coherency Extension)
Gating for each processor core's power island
Interrupts and a timer
CPU frequency: 600MHz or higher
Architecture Armv7-R
Instruction set A32/T32
Embedded Trace Macrocell (ETM), Single/Double Precision Floating Point Unit (FPU), and CoreSightTM
Independent or lock-step operation
PS on-chip RAM (OCM) is 256KB and has ECC.
Up to 36Mb of UltraRAM on-chip memory with ECC in PL
Block RAM with up to 35Mb of on-chip space with ECC in PL
Up to 11Mb of distributed RAM on the chip in PL
Automotive: Driver assistance, driver information, and infotainment
Wireless Communications: Support for multiple spectral bands and smart antennas
Wired Communications: Multiple wired communications standards and context-aware network services
Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics
Smarter Vision: Evolving video-processing algorithms, object detection, and analytics
Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety
Specification | Value |
Category | Embedded System On Chip (SoC) |
Mfr | AMD |
Series | Zynq® UltraScale+™ MPSoC EG |
Package | Tray |
Product Status | Active |
Architecture | MCU, FPGA |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 500MHz, 600MHz, 1.2GHz |
Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Case | 784-BFBGA, FCBGA |
Supplier Device Package | 784-FCBGA (23x23) |
Number of I/O | 252 |
Base Product Number | XCZU3 |
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