The second-generation multi-processing SoC system introduced by Xilinx, the XCZU4CG-L1FBVB900I, has been completely enhanced from the first-generation Zynq-7000. High-density on-chip UltraRAM static memory, single-channel speed up to 32 Gbps high-speed transceiver, integrated 100 GbE, PCIe Gen4, 150 Gbps Interlaken and other I/O controllers, and high-performance UltraScale Programming logic are just a few of the features. Encryption, security, and power management have all been much improved over Zynq-7000 series devices.
| Specification | Value |
|---|---|
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq?UltraScale+? FPGA, 192K+ Logic Cells |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
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