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Home > Product > Xilinx, Inc > Zynq UltraScale+ MPSoC
XCZU9CG-2FFVC900E

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XCZU9CG-2FFVC900E

Manufacturer:
Xilinx
Package/Case:
900-BBGA, FCBGA
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
Embedded - System On Chip (SoC)
Description:
Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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XCZU9CG-2FFVC900E Overview

The second-generation multi-processing SoC system introduced by Xilinx, the XCZU9CG-2FFVC900E, has been completely enhanced from the first-generation Zynq-7000. High-density on-chip UltraRAM static memory, single-channel speed up to 32 Gbps high-speed transceiver, integrated 100 GbE, PCIe Gen4, 150 Gbps Interlaken and other I/O controllers, and high-performance UltraScale Programming logic are just a few of the features. Encryption, security, and power management have all been much improved over Zynq-7000 series devices.

Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XCZU9CG-2FFVC900E Specifications

Specification Value
Architecture MCU, FPGA
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature 0℃ ~ 100℃ (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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