By providing cutting-edge processing capabilities in a low-cost, single-chip compact form factor programmable logic device, 10M16DCU324I6G redefines non-volatile integration. Using either single or dual-core voltage supply, densities range from 2K to 50K LEs. This builds on the single chip heritage of prior MAX device types. This 10M16DCU324I6G has both high I/O pin count and advanced tiny wafer scale packaging (3 mm × 3 mm) options.
The instant-on feature of this device is made possible by the use of TSMC's 55 nm embedded NOR flash technology. ADCs (analog-to-digital converters), which allow you to store and dynamically switch between two images on a single chip, and dual configuration flash are integrated features. Unlike CPLDs, 10M16DCU324I6G also includes full-featured FPGA capabilities, such as Nios II soft core embedded processor support, digital signal processing (DSP) blocks, and soft DDR3 memory controllers.
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 1000 |
| Number of Logic Elements/Cells | 16000 |
| Total RAM Bits | 562176 |
| Number of I/O | 246 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 324-LFBGA |
| Supplier Device Package | 324-UBGA (15x15) |
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