By providing cutting-edge processing capabilities in a low-cost, single-chip compact form factor programmable logic device, 10M40SAE144I7G redefines non-volatile integration. Using either single or dual-core voltage supply, densities range from 2K to 50K LEs. This builds on the single chip heritage of prior MAX device types. This 10M40SAE144I7G has both high I/O pin count and advanced tiny wafer scale packaging (3 mm × 3 mm) options. The instant-on feature of this device is made possible by the use of TSMC's 55 nm embedded NOR flash technology. ADCs (analog-to-digital converters), which allow you to store and dynamically switch between two images on a single chip, and dual configuration flash are integrated features. Unlike CPLDs, 10M40SAE144I7G also includes full-featured FPGA capabilities, such as Nios II soft core embedded processor support, digital signal processing (DSP) blocks, and soft DDR3 memory controllers.
10M40SAE144I7G device is a single-chip, non-volatile low-cost programmable logic device(PLDs) to integrate the optimal set of system components. The highlights of the Intel® MAX® 10 devices include:
• External PHY interface
• Two full-duplex SPI ports with three peripheral chip selects
• Two high-speed UARTs (up to 1 Mb/s)
• Two SD/SDIO 2.0/MMC3.31 compliant controllers
• Two master and slave I2C interfaces
• Internally stored dual configuration flash
• User flash memory
• Instant on support
• Integrated analog-to-digital converters (ADCs)
• Single-chip Nios II soft core processor support
System management
I/O expansion
Communication control planes
Industrial
Automotive
Consumer applications
Specification | Value |
---|---|
Number of LABs/CLBs | 2500 |
Number of Logic Elements/Cells | 40000 |
Total RAM Bits | 1290240 |
Number of I/O | 101 |
Voltage - Supply | 2.85V ~ 3.465V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 144-LQFP Exposed Pad |
Supplier Device Package | 144-EQFP (20x20) |
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