1SG280HN1F43E2VGS3

1SG280HN1F43E2VGS3 Overview

The 1SG280HN1F43E2VGS3 is a high-performance FPGA from Intel's Stratix 10 GX family, featuring advanced capabilities and specifications.

Technical Specifications

• Package Type: 1760-FBGA (42.5mm x 42.5mm)
• Operating Voltage: 0.77V to 0.97V
• Operating Temperature: 0°C to 100°C (TJ)
• I/O Configuration: 688 I/O pins
• Logic Capacity: 2.8 million logic elements
• LAB Count: 350,000 LABs/CLBs

Architecture Features

The device utilizes Intel's revolutionary Hyperflex FPGA Architecture, which delivers:

• Up to 2X performance gains compared to previous-generation FPGAs
• Enhanced power efficiency with up to 70% lower power consumption
• Bypassable Hyper-Registers throughout the FPGA fabric
• Advanced routing capabilities for eliminating critical paths

Advanced Integration

The chip incorporates Intel's innovative technologies:

• Embedded Multi-Die Interconnect Bridge (EMIB) technology for ultra-high density interconnects
• Heterogeneous 3D System-in-Package (SiP) integration
• Support for high-speed networking standards including 400GB Ethernet

Security Features

The device includes a Secure Device Manager (SDM) that provides:

• Sector-based authentication
• Multi-factor authentication
• Physically Unclonable Function (PUF)
• Enhanced resilience to single-event upsets (SEUs)

Applications

This FPGA is optimized for:

• High-performance computing applications
• Military radar and secure communication systems
• ASIC prototyping
• Wireline and wireless communication infrastructure

1SG280HN1F43E2VGS3 Specifications