EP3C25Q240C8N

EP3C25Q240C8N Overview

With to software improvements, low-power (LP) manufacturing technology, and silicon optimizations, EP3C25Q240C8N from (TSMC) provides the greatest option. With densities ranging from around 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than 14 watts of static power consumption, the EP3C25Q240C8N makes it easier for you to stay inside your power budget. The devices feature the first silicon, software, and intellectual property (IP) security features on a low-power, high-functionality FPGA architecture. These security measures protect the IP from tampering, reverse engineering, and cloning. The devices also allow for design separation, enabling you to incorporate redundancy in a single chip to reduce size, weight, and power.

EP3C25Q240C8N Features

• Lowest Power FPGAs

• Design Security Feature

• Increased System Integration

The FBGA-484 device boasts an impressive array of features. With 148 I/Os and 1539 blocks, it offers extensive connectivity and functionality. Operating within a voltage range of 1.15 to 1.25 volts, it ensures efficient power consumption. The device is compatible with both SMD and SMT mounting techniques, providing flexibility in assembly options. One standout feature is the distributed RAM, which boasts a substantial size of 608 Mbit. This tray-packaged RAM offers ample storage capacity for various applications, making it a valuable asset in any project or system requiring high-performance memory capabilities. 

EP3C25Q240C8N Applications

• Driver information

• Infotainment

• Broadcast camera

• Medical diagnostics and imaging

EP3C25Q240C8N Specifications