The EP3C40F484C8N is the best device for anyone looking for a reliable yet reasonably priced solution. It provides a unique and uncommon blend of excellent functionality and low power usage. Thanks to Taiwan Semiconductor Manufacturing Company's adoption of the LP process technology, the device is built for power efficiency, making it ideal for high-volume applications where energy consumption is a concern. Additionally, the software capabilities of the EP3C40F484C8N significantly lower power consumption, making it an even more appealing alternative for businesses looking to reduce costs without sacrificing performance. Overall, if you're looking for a low-cost, low-power product that doesn't sacrifice functionality or quality, this is a great option.
Lowest Power FPGAs
Design Security Feature
Increased System Integration
The 1 Mbit distributed RAM is packaged in a tray. With a total of 331 I/Os, this device offers extensive connectivity options, allowing for seamless integration into various systems. Its 2475 blocks provide ample storage capacity for data processing and manipulation. Operating at a maximum frequency of 315 MHz, this device guarantees swift and efficient performance. The operating supply voltage range of 1.15 volts to 1.25 volts ensures optimal power consumption while maintaining stable operation. Utilizing SMD or SMT mounting techniques, this device offers versatility in its installation process, catering to different manufacturing requirements. Overall, the combination of these features makes the tray-packaged 1 Mbit distributed RAM a reliable and versatile component for various applications.
Driver information
Infotainment
Broadcast camera
Medical diagnostics and imaging
Video and night vision equipment
LTE radio and baseband
Multifunction printers
| Specification | Value |
|---|---|
| Series | Cyclone III |
| Number of Logic Blocks | 2475 |
| Embedded Block RAM - EBR | 1161 kbit |
| Number of I/Os | 331 |
| Maximum Operating Frequency | 315 MHz |
| Operating Supply Voltage | 1.15 V to 1.25 V |
| Maximum Operating Temperature | + 70 C |
| Mounting Style | SMD/SMT |
| Package / Case | FBGA-484 |
| Distributed RAM | 1 Mbit |
| Minimum Operating Temperature | 0 C |
| Packaging | Tray |
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