The LFE2-12SE-6FN256I of FPGA devices are designed to give high-performance capabilities including sophisticated DSP blocks, high-speed SERDES (LatticeECP2M family only), and high-speed source synchronous interfaces in a budget-friendly FPGA fabric. This combination was made possible by 90nm technology and improvements in device architecture. High performance and low cost are priorities when designing the LFE2-12SE-6FN256I fabric. The LFE2-12SE-6FN256I feature encryption ("S" versions only) and dual boot capabilities, as well as LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source synchronous I/O support, and enhanced sysDSP blocks. High-speed SERDES with PCS is a feature of the LFE2-12SE-6FN256I. These SERDES with PCS blocks, which have high jitter tolerance and low transmission jitter, can be set up to handle a variety of well-liked data protocols, including PCI Express, Ethernet (1GbE and SGMII), OBSAI, and CPRI. Chip-to-chip and small form factor backplane applications are well suited for SERDES thanks to their transmit pre-emphasis and receive equalization settings. Large complicated designs can be efficiently built using the LFE2-12SE-6FN256I thanks to Lattice Diamond design software. Popular logic synthesis tools include support for LFE2-12SE-6FN256I synthesis libraries. The Diamond software places and routes the design in the LFE2-12SE-6FN256I using the output from the synthesis tool and the limitations of its floor planning tools. For timing verification, the Diamond design tool pulls the timing from the routing and back-annotates it into the design. For the LFE2-12SE-6FN256I, Lattice offers a wide variety of pre-engineered IP (Intellectual Property) modules. Because these IP cores serve as standardized building blocks, designers are free to focus on the distinctive features of their designs, which boosts productivity.
Specification | Value |
---|---|
Number of I/Os | 193 |
Maximum Operating Frequency | 320 MHz |
Operating Supply Voltage | 1.2 V |
Maximum Operating Temperature | + 100 C |
Mounting Style | SMD/SMT |
Package / Case | FPBGA-256 |
Minimum Operating Temperature | - 40℃ |
Packaging | Tray |
Factory Pack Quantity | 450 |
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