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LFXP2-8E-5TN144C

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LFXP2-8E-5TN144C

Manufacturer:
Lattice
Package/Case:
TQFP-144
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
Product Categories:
FPGA - Field Programmable Gate Array
Description:
FPGA LatticeXP2 Family 8000 Cells 90nm Technology 1.2V 144-Pin TQFP Tray
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LFXP2-8E-5TN144C Overview

The flexiFLASH architecture used by LFXP2-8E-5TN144C combines a Look-up Table (LUT) based FPGA fabric with non-volatile Flash cells. Instant-on, limitless reconfigurability, on-chip storage with FlashBAK integrated block memory and Serial TAG memory, as well as design security, are advantages of the flexiFLASH technology. The components also enable 128-bit AES Encryption, Live Updates with TransFR, and Dual-boot technologies.

High performance and low cost were priorities when developing the LFXP2-8E-5TN144C for the new technology. Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support, distributed and embedded memory, LUT-based logic, and improved sysDSP blocks are all features of LFXP2-8E-5TN144C . Using LFXP2-8E-5TN144C, big and complicated designs may be efficiently implemented thanks to Lattice Diamond design software. Popular logic synthesis tools can support LFXP2-8E-5TN144C synthesis libraries. The Diamond software places and routes the design in the LFXP2-8E-5TN144C device using the output from the synthesis tool and the limitations from its floor planning tools.

For timing verification, the Diamond tool pulls the timing from the routing and back-annotates it into the design. For LFXP2-8E-5TN144C, Lattice offers a wide variety of LatticeCORE pre-designed Intellectual Property (IP) modules. Designers are able to concentrate on the distinctive elements of their designs, enhancing productivity, by employing these IPs as standardized building blocks.

LFXP2-8E-5TN144C Specifications

Specification Value
Number of I/Os 100
Operating Supply Voltage 1.2 V
Maximum Operating Temperature + 85℃
Mounting Style SMD/SMT
Package / Case TQFP-144
Minimum Operating Temperature 0 C
Packaging Tray
Factory Pack Quantity 300

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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