Industry-leading connectivity features like high logic-to-pin ratios, small form-factor packaging, the MicroBlazeTM soft processor, and a wide range of supported I/O protocols are all included in the XC6SLX150-3FG900I. Ideal for a variety of cutting-edge bridging uses in consumer electronics, automotive infotainment, and industrial automation.
Over 40 I/O standards for simplified system design
PCI Express® with integrated endpoint block
Up to 8 low power 3.2Gb/s serial transceivers
800Mb/s DDR3 with integrated memory controller
Cost-optimized for system I/O expansion
MicroBlaze™ processor soft IP to eliminate external processor or MCU components
Wireless Communications
Medical
High Performance Computing and Data Storage
Consumer Electronics
Aerospace & Defense
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 11519 |
| Number of Logic Elements/Cells | 147443 |
| Total RAM Bits | 4939776 |
| Number of I/O | 576 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 900-BBGA |
| Supplier Device Package | 900-FBGA (31x31) |
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