This bundle is available for purchase and is a part of the FBGA bundle. Data may be transported more efficiently thanks to the 576 I/Os in total. There are 147443 logic elements or cells that make up a fundamental building block. As long as FPGA electronics are installed in the Surface Mount direction, this FPGA is capable of performing in accordance with its specifications. With a supply voltage of 1V, designers may make the most of its flexibility. This module has a 100°C maximum operating temperature. Operating conditions should be warmer than -40°C. Its fundamental unit is made up of 11519 logic blocks (LABs). Consequently, 184304 registers are utilized to store and transport data.
Up to 8 low power 3.2Gb/s serial transceivers
800Mb/s DDR3 with integrated memory controller
Cost-optimized for system I/O expansion
MicroBlaze™ processor soft IP to eliminate external processor or MCU components
1.2V core voltage or 1.0V core voltage option
Zero power with hibernate power-down
Telecommunication
Wireless Communications
Voice recognition
Embedded Vision
Specification | Value |
---|---|
Logic Cells | 147,443 |
Memory (Kb) | 4,824 |
DSP Slices | 180 |
3.2 Gb/s Transceivers | - |
Maximum I/O | 576 |
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