This package is offered for sale and is a part of the 484-FBGA, CSPBGA bundle. For more effective data transfer, there are 338 I/Os accessible. A basic construction block consists of 147443 logic components or cells. The development board can be connected to this FPGA module via Surface Mount connections. The working temperature should be maintained between 0°C and 85°C TJ when in use. Tray is a space-saving container that includes an FPGA model. The versatility of 1.2V supply voltage can be fully utilized by designers. This module can withstand temperatures up to 85°C during normal operation. The operating temperature should be higher than 0°C.
Cost-optimized for system I/O expansion
MicroBlaze™ processor soft IP to eliminate external processor or MCU components
1.2V core voltage or 1.0V core voltage option
Zero power with hibernate power-down mode
Consumer Electronics
Artificial Intelligence
5G Technology
Cloud Computing
Wireless Technology
Industrial Control
Specification | Value |
---|---|
Number of LABs/CLBs | 11519 |
Number of Logic Elements/Cells | 147443 |
Total RAM Bits | 4939776 |
Number of I/O | 338 |
Voltage - Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0℃ ~ 85℃ (TJ) |
Package / Case | 484-FBGA, CSPBGA |
Supplier Device Package | 484-CSPBGA (19x19) |
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