XC6SLX16-2FTG256I

XC6SLX16-2FTG256I Overview

The device is compact and easy to integrate into a number of systems due to its 256-LBGA packing. This device has a large processing capacity, with 1139 LABs and CLBs and 14579 logic elements and cells. In addition, the device features 186 I/Os and 589824 RAM bits, allowing for rapid data storage and transport. The gadget is surface-mounted and operates on a voltage range of 1.14 to 1.26 volts. Because of its operating temperature range of -40 to 100 degrees Celsius TJ, it may be employed in a variety of settings. The supplier device packaging of this device, is a compact 256-FTBGA (17x17), making it ideal for applications with little space.

XC6SLX16-2FTG256I Features

• On-chip boot ROM

• 256 KB on-chip RAM (OCM)

• Byte-parity support

• Multiprotocol dynamic memory controller

• 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

• ECC support in 16-bit mode

• 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

XC6SLX16-2FTG256I Applications

• Prototyping and Validation: XC6SLX16-2FTG256I is used for rapid prototyping and testing of digital designs before manufacturing custom ASICs (Application-Specific Integrated Circuits).

• Digital Signal Processing (DSP): XC6SLX16-2FTG256I can efficiently implement complex digital signal processing algorithms such as image and audio processing, filtering, and encryption.

• Embedded Systems: XC6SLX16-2FTG256I can be used as the core component in embedded systems, integrating processors, peripherals, and custom logic into a single chip.

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Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC6SLX16-2FTG256I Specifications