XC6SLX16-2FTG256I

XC6SLX16-2FTG256I Overview

The device is compact and easy to integrate into a number of systems due to its 256-LBGA packing. This device has a large processing capacity, with 1139 LABs and CLBs and 14579 logic elements and cells. In addition, the device features 186 I/Os and 589824 RAM bits, allowing for rapid data storage and transport. The gadget is surface-mounted and operates on a voltage range of 1.14 to 1.26 volts. Because of its operating temperature range of -40 to 100 degrees Celsius TJ, it may be employed in a variety of settings. The supplier device packaging of this device, is a compact 256-FTBGA (17x17), making it ideal for applications with little space.

XC6SLX16-2FTG256I Features

• On-chip boot ROM

• 256 KB on-chip RAM (OCM)

• Byte-parity support

• Multiprotocol dynamic memory controller

• 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

• ECC support in 16-bit mode

• 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

XC6SLX16-2FTG256I Applications

• Prototyping and Validation: XC6SLX16-2FTG256I is used for rapid prototyping and testing of digital designs before manufacturing custom ASICs (Application-Specific Integrated Circuits).

• Digital Signal Processing (DSP): XC6SLX16-2FTG256I can efficiently implement complex digital signal processing algorithms such as image and audio processing, filtering, and encryption.

• Embedded Systems: XC6SLX16-2FTG256I can be used as the core component in embedded systems, integrating processors, peripherals, and custom logic into a single chip.

XC6SLX16-2FTG256I Specifications