XC6SLX16-L1CPG196I

XC6SLX16-L1CPG196I Overview

This component comes with a 196-TFBGA, CSBGA package. It can transfer data more effectively thanks to its 106 I/Os. 14579 logic cells/elements make up logic blocks. It is driven by 1 volts.  A temperature between -40°C and 100°C TJ must be maintained at all times to guarantee a safe and effective operation. There are 100 outputs built into a device like this. This FPGA model can fit inside a very small area using the Tray layout. It has 196 terminations overall. There are 589824 RAM bits available on this chip.

XC6SLX16-L1CPG196I Features

Cost-optimized for system I/O expansion

MicroBlaze™ processor soft IP to eliminate external processor or MCU components

1.2V core voltage or 1.0V core voltage option

Zero power with hibernate power-down mode

XC6SLX16-L1CPG196I Applications

Wireless Communications

High Performance Computing and Data Storage

Consumer Electronics

Aerospace & Defense

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AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC6SLX16-L1CPG196I Specifications