XC6SLX16-N3CSG324C

XC6SLX16-N3CSG324C Overview

232 I/O ports on the device allow for more efficient data transfer. A basic building block has 14579 logic cells or elements. A 1.2V supply provides the necessary power. This FPGA module can be attached to the development board using a Surface Mount connector. The system's operating temperature should stay between 0°C and 85°C TJ throughout operation. This device has 232 outputs built into it. Tray is a space-saving container that includes an FPGA model. There have been 324 terminations in total.

XC6SLX16-N3CSG324C Features

High pin-count to logic ratio for I/O connectivity

Over 40 I/O standards for simplified system design

PCI Express® with integrated endpoint block

XC6SLX16-N3CSG324C Applications

Automotive

Consumer Electronics

Artificial Intelligence

5G Technology

Cloud Computing

Wireless Technology

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AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC6SLX16-N3CSG324C Specifications