The XC6SLX16-N3FTG256C is equipped with industry-leading connectivity features like high logic-to-pin ratios, small form-factor packaging, the MicroBlazeTM soft processor, and a broad range of supported I/O protocols. This makes it ideal for a variety of cutting-edge bridging uses in consumer electronics, automotive infotainment, and industrial automation.
High pin-count to logic ratio for I/O connectivity
Over 40 I/O standards for simplified system design
PCI Express® with integrated endpoint block
Up to 8 low power 3.2Gb/s serial transceivers
800Mb/s DDR3 with integrated memory controller
Artificial Intelligence
5G Technology
Cloud computing
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Video & Image Processing
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 1139 |
| Number of Logic Elements/Cells | 14579 |
| Total RAM Bits | 589824 |
| Number of I/O | 186 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0℃ ~ 85℃ (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
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