XC6SLX25-2CSG324C

XC6SLX25-2CSG324C Overview

Because of its 324-LFBGA, CSPBGA packaging, the device is compact and easy to integrate into a number of systems. With 24051 logic elements and cells and 1879 LABs and CLBs, this device has outstanding computing power. The device also includes 226 I/Os and 958464 RAM bits, allowing for fast data storage and transport. The gadget is surface-mounted and operates on a voltage range of 1.14 to 1.26 volts. Because of its operating temperature range of 0 to 85 degrees Celsius TJ, it may be employed in a variety of situations. The tiny 324-CSPBGA (15x15) supplier device package of this device makes it ideal for applications with limited space.

XC6SLX25-2CSG324C Features

• Programmable System Integration

• Increased System Performance

• BOM Cost Reduction

• Total Power Reduction 

• Accelerated Design Productivity

XC6SLX25-2CSG324C Applications

XC6SLX25-2CSG324C enables manufactures to implement systems that can be updated when necessary. Besides, XC6SLX25-2CSG324C uses include aerospace and defense, medical electronics, digital television, consumer electronics, industrial motor control, scientific instruments, cybersecurity systems and wireless communications.

• Embedded Systems: XC6SLX25-2CSG324C can be used as the core component in embedded systems, integrating processors, peripherals, and custom logic into a single chip.

• High-Performance Computing: XC6SLX25-2CSG324C is used to accelerate computationally intensive tasks, providing hardware acceleration for specific algorithms or applications.

• Reconfigurable Systems: XC6SLX25-2CSG324C allows for dynamic reconfiguration, enabling system flexibility and adaptability.

XC6SLX25-2CSG324C Specifications