XC6SLX25-3CSG324C

XC6SLX25-3CSG324C Overview

The device is packaged in a 324-LFBGA, CSPBGA format, making it small and simple to integrate into a variety of systems. This device's processing power is outstanding, with 24051 logic elements and cells and 1879 LABs and CLBs. Furthermore, the gadget contains 958464 RAM bits and 226 I/Os for efficient data transfer and storage. Surface Mount technology is used to mount the device, which runs on a voltage range of 1.14 volts to 1.26 volts. It has an operating temperature range of -40 to 100 degrees Celsius TJ, making it suited for usage in a variety of settings. This device's supplier device package is a tiny 324-CSPBGA (15x15), making it an excellent solution for space-constrained applications.

XC6SLX25-3CSG324C Features

• Programmable System Integration

• Increased System Performance

• BOM Cost Reduction

• Total Power Reduction

• Accelerated Design Productivity

XC6SLX25-3CSG324C Applications

• Digital Signal Processing (DSP): XC6SLX25-3CSG324C can efficiently implement complex digital signal processing algorithms such as image and audio processing, filtering, and encryption.

• Embedded Systems: XC6SLX25-3CSG324C can be used as the core component in embedded systems, integrating processors, peripherals, and custom logic into a single chip.

• High-Performance Computing: XC6SLX25-3CSG324C is used to accelerate computationally intensive tasks, providing hardware acceleration for specific algorithms or applications.

XC6SLX25-3CSG324C Specifications