XC6SLX25-3CSG324I

XC6SLX25-3CSG324I Overview

To facilitate more effective data transfer, this device has 226 I/Os. 24051 logic elements/cells make up a basic building block. 1.2V is used as the supply voltage for FPGA chips. The device needs a supply voltage between 1.14V and 1.26V to function. A temperature between -40°C and 100°C TJ must be maintained at all times to guarantee a safe and effective operation. 226 outputs were integrated into this device during installation. This FPGA model can fit inside a very small area using the Tray layout. With 324 terminations, FPGA chips are designed.

XC6SLX25-3CSG324I Features

MicroBlaze™ processor soft IP to eliminate external processor or MCU components

1.2V core voltage or 1.0V core voltage option

Zero power with hibernate power-down mode

Enabled by ISE™ Design Suite—a no-cost, front-to-back

XC6SLX25-3CSG324I Applications

Ecosystem

Military Temperature

Automotive driver's assistance

Medical Electronics

Image processing

Distributed Monetary Systems

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AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC6SLX25-3CSG324I Specifications