XC6SLX25T-3CSG324I

XC6SLX25T-3CSG324I Overview

A semiconductor business called Xilinx, Inc. focuses on programmable logic devices such field-programmable gate arrays (FPGAs). One such FPGA from Xilinx's Spartan-6 family is the XC6SLX25T-3CSG324I. It contains 1.2 Mb of block RAM, 25,280 logic cells, and a maximum clock speed of 300 MHz. The -3 in the part number denotes that the highest junction temperature at which it functions is 85°C. A 324-ball chip scale package with an integrated heat spreader is referred to as a CSG324I package type.

XC6SLX25T-3CSG324I Features

• On-chip power supplies for core and I/O

• Power-optimized high-speed transceivers

• Gigabit Ethernet MAC and Tri-mode Ethernet MAC

• Dual 12-bit, 1 MSPS analog-to-digital converters (ADCs)

• 324-ball chip scale package with an integrated heat spreader

• Differential signaling support for LVDS, HTSTL, and SSTL standards

XC6SLX25T-3CSG324I Applications

• Telecommunications: wireless communication systems, baseband processors, and network processing.

• Video and image processing: video compression, real-time video processing, and digital signal processing.

• Aerospace and defense: military communications systems, secure networking, radar systems, and image processing.

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Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC6SLX25T-3CSG324I Specifications