A semiconductor business called Xilinx, Inc. focuses on programmable logic devices such field-programmable gate arrays (FPGAs). One such FPGA from Xilinx's Spartan-6 family is the XC6SLX25T-3CSG324I. It contains 1.2 Mb of block RAM, 25,280 logic cells, and a maximum clock speed of 300 MHz. The -3 in the part number denotes that the highest junction temperature at which it functions is 85°C. A 324-ball chip scale package with an integrated heat spreader is referred to as a CSG324I package type.
On-chip power supplies for core and I/O
Power-optimized high-speed transceivers
Gigabit Ethernet MAC and Tri-mode Ethernet MAC
Dual 12-bit, 1 MSPS analog-to-digital converters (ADCs)
324-ball chip scale package with an integrated heat spreader
Differential signaling support for LVDS, HTSTL, and SSTL standards
Telecommunications: wireless communication systems, baseband processors, and network processing.
Video and image processing: video compression, real-time video processing, and digital signal processing.
Aerospace and defense: military communications systems, secure networking, radar systems, and image processing.
Specification | Value |
---|---|
Number of LABs/CLBs | 1879 |
Number of Logic Elements/Cells | 24051 |
Total RAM Bits | 958464 |
Number of I/O | 190 |
Voltage - Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 324-LFBGA, CSPBGA |
Supplier Device Package | 324-CSPBGA (15x15) |
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