XC6SLX45-L1CSG324C

XC6SLX45-L1CSG324C Overview

The device is a versatile and high-performance device that may be used for a variety of purposes. The large temperature range of -40°C to 100°C (TJ) may be operated by this IC, which has 218 I/Os. It's installed on the surface and is packaged in a 324-LFBGA, CSPBGA way. Integrated Circuits (ICs) are a subcategory of which the XC6SLX45 IC belongs as a member of the XC6SLX45 family. This IC is well-liked and has little risk of counterfeiting on the open market. 126 units are contained in each package, and supply and demand are in balance. MSL level is 3 (168 Hours), and REACH status is unchanged. 51 weeks is the projected lead time for manufacturing, which makes it a great option for many applications.

XC6SLX45-L1CSG324C Features

• Fast design closure using integrated wizards

• Programmable System Integration

• Increased System Performance

• BOM Cost Reduction

• Total Power Reduction

• Accelerated Design Productivity

XC6SLX45-L1CSG324C Applications

• Communications

• Automotive

• Consumer Electronics

• Artificial Intelligence

• 5G Technology

• Cloud Computing

• Wireless Technology

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Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC6SLX45-L1CSG324C Specifications