XC6SLX75-2FGG676I
A series Field Programmable Gate Array (FPGA) IC with a 676-BGA packaging and surface mounting is the XC6SLX75-2FGG676I. It can operate at temperatures between -40°C and 100°C (TJ). With 408 I/Os and a false threat of 93 percent in the open market, this IC is a balanced product. There are 40 pieces in each package, and it is very well-liked. Its expected lead time for manufacture is 51 weeks, and REACH has no impact on it. The ECCN for it is 3A991D.
High pin-count to logic ratio for I/O connectivity
Over 40 I/O standards for simplified system design
PCI Express® with integrated endpoint block
Up to 8 low power 3.2Gb/s serial transceivers
800Mb/s DDR3 with integrated memory controller
Wireless Communications
High Performance Computing and Data Storage
Consumer Electronics
Aerospace & Defense
| Specification | Value |
|---|---|
| Product Lifecycle Status | Active |
| Mounting Style | Surface Mount |
| Case/Package | FBGA |
| RoHS | Compliant |
| Lead-Free Status | Lead Free |
| HK STC License | NLR |
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