Industry-leading connectivity features including high logic-to-pin ratios, tiny form-factor packaging, the MicroBlazeTM soft processor, and a wide range of supported I/O protocols are all included in the XC6SLX75-N3FG676I. ideal for a variety of cutting-edge bridging uses in consumer electronics, automobile infotainment, and industrial automation.
Increased System Performance
BOM Cost Reduction
Total Power Reduction
Cost-optimized for system I/O expansion
High pin-count to logic ratio for I/O connectivity
Wireless Technology
Industrial Control
Video & Image Processing
Wired Communications
Artificial Intelligence
5G Technology
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 408 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
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