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Home > Product > Xilinx, Inc > Spartan 6 FPGAs
XC6SLX75-N3FGG676C

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XC6SLX75-N3FGG676C

Manufacturer:
Xilinx
Package/Case:
FBGA-676
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC6SLX75-N3FGG676C
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
FPGA Spartan-6 LX Family 74637 Cells 45nm Technology 1.2V 676-Pin FBGA
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XC6SLX75-N3FGG676C Overview

XC6SLX75-N3FGG676C is an Integrated Circuit (IC) that belongs to the category of FPGAs (Field Programmable Gate Array). It comes in a 676-FBGA (27x27) supplier device package and has a standard package of 40. This IC has a surface mount mounting feature and has a total of 408 I/O. It has 5831 LABs/CLBs and 74637 logic elements/cells. With a total of 3170304 RAM bits, this IC has a voltage supply of 1.14V ~ 1.26V. It operates in a temperature range of 0°C ~ 85°C (TJ). This IC is ROHS3 Compliant.

XC6SLX75-N3FGG676C Features

  • Enabled by ISE™ Design Suite—a no-cost, front-to-back

  • FPGA design solution for Linux and Windows

  • Fast design closure using integrated wizards

  • Programmable System Integration

  • Increased System Performance

  • BOM Cost Reduction

XC6SLX75-N3FGG676C Applications

  • Automotive

  • Consumer Electronics

  • Artificial Intelligence

  • 5G Technology

  • Cloud Computing


XC6SLX75-N3FGG676C Specifications

SpecificationValue
Number of LABs/CLBs5831
Number of Logic Elements/Cells74637
Total RAM Bits3170304
Number of I/O408
Voltage - Supply1.14V ~ 1.26V
Mounting TypeSurface Mount
Operating Temperature0℃ ~ 85℃ (TJ)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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