High logic-to-pin ratios, tiny form-factor packaging, the MicroBlazeTM soft processor, and a variety of supported I/O protocols are just a few of the industry-leading connectivity features provided by the XC6SLX75T-3FG484I. suitable for a variety of cutting-edge bridging applications found in consumer, automotive, and industrial automation.
High pin-count to logic ratio for I/O connectivity
Over 40 I/O standards for simplified system design
PCI Express® with integrated endpoint block
Up to 8 low power 3.2Gb/s serial transceivers
800Mb/s DDR3 with integrated memory controller
Cost-optimized for system I/O expansion
Artificial Intelligence
5G Technology
Cloud computing
Consumer electronics
Wireless Technology
Industrial Control
Internet of Things
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 268 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 484-BBGA |
| Supplier Device Package | 484-FBGA (23x23) |
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