XC6SLX75T-3FG676I
A low-cost, low-power, logic-optimized FPGA that offers quick and thorough connectivity is the XC6SLX75T-3FG676I. The device's connectivity features that set it apart from the competition include high logic-to-pin ratios, small form-factor packaging, the soft processor, and a variety of supported I/O. ideal for a range of innovative bridging applications in consumer electronics, automotive infotainment, and industrial automation. Manufacturers can now implement systems that can be updated as needed thanks to the chip. In addition, uses include wireless communications, industrial motor control, medical electronics, consumer electronics, digital television, aerospace and defense, and consumer electronics.
Fast design closure using integrated wizards
Programmable System Integration
Increased System Performance
BOM Cost Reduction
Total Power Reduction
Wireless Communications
High Performance Computing and Data Storage
Consumer Electronics
Aerospace & Defense
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 348 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
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