XC6SLX75T-3FGG484I
A high-performance component made for use in electrical systems is the XC6SLX75T-3FGG484I FPGA. It has 5831 LABs/CLBs, 74637 logic components, and 3170304 RAM bits overall. The 484-FBGA (23x23) supply device package and SMD mounting technique of this FPGA make it appropriate for usage in a variety of applications. This component's operational temperature range is -40°C to 100°C, and its supply voltage ranges from 1.14V to 1.26V. The 484-BBGA package for the XC6SLX75T-3FGG484I FPGA has a manufacturer pack quantity of 60 units. Its popularity is poor, and 53% of the general market perceives it as a phony danger. This component's supply and demand conditions are constrained, and its MSL level is 3 (168 hours).
Up to 8 low power 3.2Gb/s serial transceivers
800Mb/s DDR3 with integrated memory controller
Cost-optimized for system I/O expansion
High pin-count to logic ratio for I/O connectivity
Over 40 I/O standards for simplified system design
Internet of Things
Medical Equipment
5G Technology
Cloud computing
Consumer electronics
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 268 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 484-BBGA |
| Supplier Device Package | 484-FBGA (23x23) |
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