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Home > Product > Xilinx, Inc > Spartan 6 FPGAs
XC6SLX9-N3FTG256C

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XC6SLX9-N3FTG256C

Manufacturer:
Xilinx
Package/Case:
FTBGA-256
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC6SLX9-N3FTG256C
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
FPGA Spartan-6 LX Family 9152 Cells 45nm Technology 1.2V 256-Pin FTBGA
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XC6SLX9-N3FTG256C Overview

The device has 186 I/Os and is mounted on a 256-LBGA package. It is designed to operate within a temperature range of 0°C to 85°C. The XC6SLX9-N3FTG256C has a high popularity rating in the market and is ideal for use in integrated circuits. The IC is classified under the HTSUS code 8542.39.0001 and comes in trays with 90 pieces per package. It has an ECCN rating of EAR99 and an estimated production lead time of 51 weeks.

XC6SLX9-N3FTG256C Features

  • Enabled by ISE™ Design Suite—a no-cost, front-to-back

  • FPGA design solution for Linux and Windows

  • Fast design closure using integrated wizards

  • Programmable System Integration

  • Increased System Performance

  • BOM Cost Reduction

  • Total Power Reduction

XC6SLX9-N3FTG256C Applications

  • Automotive

  • Consumer Electronics

  • Artificial Intelligence

  • 5G Technology

  • Cloud Computing

  • Wireless Technology

 


XC6SLX9-N3FTG256C Specifications

SpecificationValue
Number of LABs/CLBs715
Number of Logic Elements/Cells9152
Total RAM Bits589824
Number of I/O186
Voltage - Supply1.14V ~ 1.26V
Mounting TypeSurface Mount
Operating Temperature0℃ ~ 85℃ (TJ)
Package / Case256-LBGA
Supplier Device Package256-FTBGA (17x17)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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