The AMD Xilinx XC73108-12PCG84C is classified as a Field Programmable Gate Array (FPGA). All XC73108-12PCG84C EPLDs include programmable power management features to specify high-performance or low-power operation on an individual Macrocell-by-Macrocell basis. Unused Macrocells are automatically turned off to minimize power dissipation. Designers can operate speed-critical paths at maximum performance, while non-critical paths dissipate less power. Xilinx development software supports XC73108-12PCG84C EPLD design using third-party schematic entry tools, HDL compilers, or direct equation-based text files. Using a PC or a workstation and one of these design capture methods, designs are automatically mapped to this device in a matter of minutes. This device is available in plastic and ceramic leaded chip carriers, pin-grid-array (PGA), ball-grid-array (BGA), and quad flat pack (QFP) packages. Package options include both windowed ceramic for design prototypes and one-time programmable plastic versions for cost-effective production volume. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.
MicroBlaze™ processor: The MicroBlaze™ processor is a soft processor that can be used to quickly deploy embedded processing.
36 Kb dual-port block RAM: The 36 Kb dual-port block RAM has integrated FIFO circuitry for on-chip data buffering.
High-performance SelectIO™ technology: The high-performance SelectIO™ technology supports DDR3 interfaces up to 1,866 Mb/s.
Integrated PCI Express® (PCIe) block: The integrated PCI Express® (PCIe) block supports up to x8 Gen3 Endpoint and Root Port designs.
Powerful clock management tiles (CMT): The powerful clock management tiles (CMT) integrate mixed-mode clock manager (MMCM) and phase-locked loop (PLL) blocks for high precision and minimal jitter.
Dual 12-bit 1MSPS analog-to-digital converters: The dual 12-bit 1MSPS analog-to-digital converters with on-chip supply and heat sensors make up the user-configurable analog interface (XADC).
Sensor fusion
Vehicles and transportation
Embedded vision
Consumer electronics
Medical devices
Defense applications
The embedded OEM
Specification | Value |
---|---|
Typical 22V10 Equivalent | 12 |
Number of Macrocells | 108 |
Number of Function Blocks | 12 |
Number of Flip-Flops | 198 |
Number of Fast Inputs | 12 |
Number of Signal Pins | 120 |
Buy XC73108-10PQ160C Xilinx, Inc, Get familiar with the XC73108-10PQ160C XC7300 CMOS EPLD at VEKEMO ...
Buy XC73108-10PQ100I Xilinx, Inc, Get familiar with the XC73108-10PQ100I XC7300 CMOS EPLD at VEKEMO ...
Buy XC73108-10PQ100C Xilinx, Inc, Get familiar with the XC73108-10PQ100C XC7300 CMOS EPLD at VEKEMO ...
Buy XC73108-10PG144I Xilinx, Inc, Get familiar with the XC73108-10PG144I XC7300 CMOS EPLD at VEKEMO ...
Buy XC73108-10PG144C Xilinx, Inc, Get familiar with the XC73108-10PG144C XC7300 CMOS EPLD at VEKEMO ...