The XC7300 family uses a distinctive Dual-Block architecture that enables fast operations via Fast Function Blocks and/or high density functionality via High Density Function Blocks. For crucial decoding and ultrafast state machine applications, Fast Function Blocks (FFBs) offer quick pin-to-pin speed and logic throughput. In order to build complex functions with predictable timing for adders and accumulators, wide functions and state machines needing numerous product terms, and other types of sophisticated logic, High-Density Function Blocks (FBs) are used.
The Universal Interconnect Matrix (UIM), which ensures complete interconnection of all internal processes, is another feature of the XC7300 architecture. All routing paths through the UIM have consistent, minimal interconnect delays thanks to this interconnect strategy. Regardless of where the logic is placed within the chip, constant connection delays make device timing simpler and ensure design performance.Each and every XC7300 gadget is built using 0.8 CMOS EPROM technology. Each XC7300 EPLD has programmable power management features that allow Macrocell-by-Macrocell customization of high-performance or low-power operation. To save power loss, unused macrocells are automatically turned off. Speed-critical paths can be operated at maximum performance while non-critical paths use less energy.
Direct equation-based text files, HDL compilers, or third-party schematic entry tools are all supported by Xilinx development software for XC7300 EPLD design. Designs are instantly translated to an XC7300 EPLD using a PC or workstation and one of three design capture techniques.
The XC7300 devices come in pin-grid array (PGA), ball-grid array (BGA), and quad flat pack (QFP) packaging, as well as plastic and ceramic leaded chip carriers. Windowed ceramic packaging for design prototypes and one-time programmable plastic packaging for high production volumes are available as alternatives.
