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Home > Product > Xilinx, Inc > XC7300 CMOS EPLD
XC7372PC68

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XC7372PC68

Manufacturer:
Xilinx
Package/Case:
PLCC68
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7372PC68
Product Categories:
XC7300 CMOS EPLD
Description:
CMOS EPLD, ERASABLE PROGRAMMABLE LOGIC DEVICE 8 blocks 12 inputs 84 signal pins
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XC7372PC68 Overview

The XC7372PC68 Devices have a special Dual-Block design that allows for high density capability via High Density Function Blocks and/or high speed operations via Fast Function Blocks. For crucial decoding and ultrafast state machine applications, Fast Function Blocks (FFBs) offer fast, pin-to-pin speed and logic throughput. For adders, accumulators, wide functions, state machines needing a large number of product terms, and other types of complicated logic, High-Density Function Blocks (FBs) offer the maximum logic density and system-level functionality to construct complex functions with predictable time. The Universal Interconnect Matrix (UIM), which ensures 100% interconnectivity of all internal processes, is also utilized by the XC7372PC68 architecture. For any routing path across the UIM, this interconnect architecture offers consistent, brief connectivity delays. Constant connectivity delays, independent of logic arrangement within the chip, simplify device timing and ensure design performance. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.


XC7372PC68 Features

  • Real 6-input lookup table (LUT)-based advanced high-performance FPGA logic that may be configured as distributed memory. 

  • Block RAM with a built-in FIFO for on-chip data buffering, 36 Kb, twin ports. 

  • High-speed SelectIOTM technology that is compatible with DDR3 connections of up to 1,866 Mb/s. 

  • High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s. 

  • A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 


XC7372PC68 Applications

  • Consumer

  • Automotive

  • Defense and military

  • Medical Endoscope

  • Small Cell Baseband

  • Machine vision camera

  • Automated manufacturing

  • Portable ultrasound

  • Industrial control

  • Sensor fusion

  • Vehicles and transportation


XC7372PC68 Specifications

SpecificationValue
Typical 22V10 Equivalent8
Number of Macrocells72
Number of Function Blocks8
Number of Flip-Flops126
Number of Fast Inputs12
Number of Signal Pins84

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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