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Home > Product > Xilinx, Inc > XC7300 CMOS EPLD
XC73108-12PG144I

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XC73108-12PG144I

Manufacturer:
Xilinx
Package/Case:
CPGA-144
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC73108-12PG144I
Product Categories:
XC7300 CMOS EPLD
Description:
CPLD XC73108 Family 108 Macro Cells 0.8um Technology 5V 144-Pin Windowed CPGA
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XC73108-12PG144I Overview

The AMD Xilinx XC73108-12PG144I is an integrated circuit that falls under the category of Field Programmable Gate Arrays (FPGAs). All XC73108-12PG144I EPLDs include programmable power management features to specify high-performance or low-power operation on an individual Macrocell-by-Macrocell basis. Unused Macrocells are automatically turned off to minimize power dissipation. Designers can operate speed-critical paths at maximum performance, while non-critical paths dissipate less power. Xilinx development software supports XC73108-12PG144I EPLD design using third-party schematic entry tools, HDL compilers, or direct equation-based text files. Using a PC or a workstation and one of these design capture methods, designs are automatically mapped to this device in a matter of minutes. This device is available in plastic and ceramic leaded chip carriers, pin-grid-array (PGA), ball-grid-array (BGA), and quad flat pack (QFP) packages. Package options include both windowed ceramic for design prototypes and one-time programmable plastic versions for cost-effective production volume. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC73108-12PG144I Features

  • Block RAM with a built-in FIFO for on-chip data buffering, 36 Kb, twin ports. 

  • High-speed SelectIOTM technology that is compatible with DDR3 connections of up to 1,866 Mb/s. 

  • High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s. 

  • A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 


XC73108-12PG144I Applications

  • Portable ultrasound

  • Industrial control

  • Sensor fusion

  • Vehicles and transportation

  • Embedded vision

  • Consumer electronics

  • Medical devices


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC73108-12PG144I Specifications

SpecificationValue
Typical 22V10 Equivalent12
Number of Macrocells108
Number of Function Blocks12
Number of Flip-Flops198
Number of Fast Inputs12
Number of Signal Pins120

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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