All XC73108-WC84ACK EPLDs include programmable power management features to specify high-performance or low-power operation on an individual Macrocell-by-Macrocell basis. Unused Macrocells are automatically turned off to minimize power dissipation. Designers can operate speed-critical paths at maximum performance, while non-critical paths dissipate less power. Xilinx development software supports XC73108-WC84ACK EPLD design using third-party schematic entry tools, HDL compilers, or direct equation-based text files. Using a PC or a workstation and one of these design capture methods, designs are automatically mapped to an XC73108-WC84ACK EPLD in a matter of minutes. The XC73108-WC84ACK devices are available in plastic and ceramic leaded chip carriers, pin-grid-array (PGA), ball-grid-array (BGA), and quad flat pack (QFP) packages. Package options include both windowed ceramic for design prototypes and one-time programmable plastic versions for cost-effective production volume.
High-speed arithmetic carry network with 18-bit accumulators operating at 43 to 61 MHz and a 1 ns ripple-carry latency per bit
Several separate clocks
Every input can be set to be registered, latched, or direct.
24 mA high-drive output with 3.3 V or 5 V I/O operation
3.3 V ±0.3 V JEDEC Standard (8-1A) is met.
Options for power control
Several security components to safeguard designs
Equipped with design and verification tools that are industry standard
PCI compliance is 100%
Industrial control
Sensor fusion
Vehicles and transportation
Embedded vision
Consumer electronics
Medical devices
Defense applications
The embedded OEM
Specification | Value |
---|---|
Typical 22V10 Equivalent | 12 |
Number of Macrocells | 108 |
Number of Function Blocks | 12 |
Number of Flip-Flops | 198 |
Number of Fast Inputs | 12 |
Number of Signal Pins | 120 |
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