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Home > Product > Xilinx, Inc > XC7300 CMOS EPLD
XC7372-10PC68C

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XC7372-10PC68C

Manufacturer:
Xilinx
Package/Case:
PLCC68
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7372-10PC68C
Product Categories:
XC7300 CMOS EPLD
Description:
CMOS EPLD, ERASABLE PROGRAMMABLE LOGIC DEVICE
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XC7372-10PC68C Overview

The XC7372-10PC68C is a high-performance custom part manufactured by Xilinx Inc. The RoHS requirements are not met by this specific component. This part has a 62% fake danger in the open market due to its middling popularity and limited supply and demand conditions. A cross-reference for an alternative part to the custom part XC7372-10PC68C is XC737210PC68C. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC7372-10PC68C Features

  • High-speed SelectIOTM technology that is compatible with DDR3 connections of up to 1,866 Mb/s. 

  • High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s. 

  • A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 

  • Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.


XC7372-10PC68C Applications

  • Medical Endoscope

  • Small Cell Baseband

  • Professional Cameras

  • Machine Vision

  • Carrier Ethernet Backhaul

  • Multi-function Printers

  • Multi-Axis Motor Control


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7372-10PC68C Specifications

SpecificationValue
Alternative Parts (Cross-Reference)XC737210PC68C
Supply and Demand StatusLimited
Fake Threat In the Open Market62 pct.
PopularityMedium
ManufacturerXilinx Inc.
CategoriesCustom Parts
Win Source Part Number1228716-XC7372-10PC68C
RoHSNon-Compliant


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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