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Home > Product > Xilinx, Inc > Virtex-7 FPGAs
XC7VX330T-2FF1157C

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XC7VX330T-2FF1157C

Manufacturer:
Xilinx
Package/Case:
1156-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7VX330T-2FF1157C
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
Virtex-7 FPGA 600 I/O 1157FCBGA 27648000 326400 Cells
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XC7VX330T-2FF1157C Overview

The AMD Xilinx XC7VX330T-2FF1157C is an integrated circuit that falls under the category of Field Programmable Gate Arrays (FPGAs). The XC7VX330T-2FF1157C FPGAs from Xilinx cover the full spectrum of system needs, from low cost, small form factor, cost-sensitive, high volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing ability for the high reliability needs beyond commercial applications. This device offers a fully programmable alternative to ASSPs and ASICs. They are built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. They enable an unprecedented increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP. Virtex-7, MMCM, PLL, 600 I/Os, 741 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1927 are all features of the Xilinx FPGAs (Field Programmable Gate Array) series XC7VX330T-2FF1157C. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.


XC7VX330T-2FF1157C Features

  • 36 Kb dual-port block RAM: The 36 Kb dual-port block RAM has integrated FIFO circuitry for on-chip data buffering.

  • High-performance SelectIO™ technology: The high-performance SelectIO™ technology supports DDR3 interfaces up to 1,866 Mb/s.

  • Integrated PCI Express® (PCIe) block: The integrated PCI Express® (PCIe) block supports up to x8 Gen3 Endpoint and Root Port designs.

  • Powerful clock management tiles (CMT): The powerful clock management tiles (CMT) integrate mixed-mode clock manager (MMCM) and phase-locked loop (PLL) blocks for high precision and minimal jitter.

  • Dual 12-bit 1MSPS analog-to-digital converters: The dual 12-bit 1MSPS analog-to-digital converters with on-chip supply and heat sensors make up the user-configurable analog interface (XADC).

  • Built on low-power (HPL), 28nm, high-k metal gate (HKMG) process technology

  • Up to 2M logic cells, VCXO component, AXI IP, and AMS integration

  • Up to 2.8TB/s total serial bandwidth with up to 96 x 13.1G GTs, up to 16 x 28.05G GTs, 5,335 GMACs, 68Mb BRAM, DDR3-1866


XC7VX330T-2FF1157C Applications

  • Small Cell Baseband

  • Professional Cameras

  • Machine Vision

  • Carrier Ethernet Backhaul

  • Multi-function Printers

  • Multi-Axis Motor Control

  • Programmable Logic Controller


XC7VX330T-2FF1157C Specifications

SpecificationValue
Number of LABs/CLBs25500
Number of Logic Elements/Cells326400
Total RAM Bits27648000
Number of I/O600
Voltage - Supply0.97V ~ 1.03V
Mounting TypeSurface Mount
Operating Temperature0℃ ~ 85℃ (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1157-FCBGA (35x35)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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